The U.S. Department of War announced a $16 million investment in BAE Systems to boost domestic production capabilities for radiation-hardened microelectronics crucial for national defense. This funding, provided through Defense Production Act (DPA) Title III, supports the Secretary of War's goal to strengthen deterrence and rebuild the military by enhancing key defense industrial base capabilities and supply chain resilience.
Assistant Secretary of War for Industrial Base Policy, the Honorable Michael Cadenazzi, emphasized the importance of these components. "Radiation-hardened microelectronics are critical for DoW missile, space, and strategic systems," Cadenazzi said, adding that "This project ensures qualified products are available to the DoW."
The DPA Title III funds will enable BAE Systems to reestablish its RH45® Storefront capability. This initiative will provide trusted Radiation Hardened by Design 45nm Application Specific Integrated Circuit and Application Specific Standard Product offerings, creating a self-sustaining hub for customers to develop and produce custom chips.
Jeffrey Frankston, Acting Deputy Assistant Secretary of War for Industrial Base Resilience, highlighted the long-term benefits. "This effort ensures that 45nm silicon-on-insulator technology remains available to DoW systems," Frankston said. He further noted that this "provides cost-avoidance, so programs are not forced to redesign and requalify their systems." This investment is one of five DPA Title III investments, totaling $102.6 million, made by the Warfighting Investment, Resourcing, and Execution (WIRE) directorate since Fiscal Year 2026 began.